Seed round now open

European power semiconductor platform

Invest in the evidence behind high-power silicon.

Cybolution is building a responsive European source for custom power diodes and thyristors — beginning with a capital-efficient partner model and scaling only after repeatable technical and customer evidence.

Start an investor conversation View the market case

2round bare chip families: thyristors and diodes

18 monthsto a physical evidence package and scale decision

1st diffusion banka semi-finished inventory advantage for shorter lead time

Bare round silicon chips

Round thyristor silicon chip with a distributed gate pattern and protected bevel

Round power diode silicon chip with perimeter rings and protected bevel

Market signal

Electrification expands the installed base that power devices must control.

The public opportunity is broader than one headline market-size number. More electricity, more grid investment and more low-emissions generation create additional conversion, switching, protection and replacement demand across infrastructure with long service lives.

3.6%

Average annual electricity-demand growth

IEA forecast for 2026–2030, supported by industry, transport, buildings and data centres.

IEA Electricity 2026 ↗

€584bn

EU grid investment required by 2030

The European Commission frames modernisation, capacity and flexibility as a major infrastructure need.

European Commission ↗

50%

Low-emissions share of global generation by 2030

Renewables and nuclear are forecast to reach half of global generation, increasing conversion and grid-control complexity.

IEA Electricity 2026 ↗

Cybolution's entry wedge

Specialised demand, not commodity volume.

The initial focus is on applications where qualification pain, discontinued components, engineering access and traceable small lots matter more than catalogue pricing. This is a narrower market than all power semiconductors — and a more realistic place for a seed-stage supplier to win.

Priority demand pools

Grid conversion and protection
Industrial drives and rectifiers
Rail and traction infrastructure
Welding and high-current supplies
Long-life legacy equipment
Custom and second-source programmes

Product platform

Two round chip families. One traceable silicon platform.

Cybolution starts with unassembled circular silicon chips. The diffusion–thickness–electrical response loop is developed at chip level, then qualified into the customer’s selected assembly route.

Round distributed-gate thyristor silicon chip

Distributed-gate thyristor chips

Round silicon SCR chips with a branching distributed gate pattern, peripheral guard region and protected bevel for high-voltage edge control.

Round diode chips

Circular silicon diode chips with uniform active metallisation, perimeter guard rings and a protected beveled edge, ready for downstream bonding and assembly.

Chip first. Package later.

Cybolution supplies the round silicon chip. A selected production partner completes the downstream route — including finishing and Si–Mo bonding — before the chip is used in the customer’s chosen press-pack, stud or module assembly.

Capital discipline

Scale control only after the process earns it.

The operating model avoids funding a complete factory before yield, repeatability and customer pull are visible.

Partner completion

Cybolution controls first diffusion and thickness. A qualified mass-production partner completes downstream wafer processing, beveling, die preparation and Si–Mo bonding.

Equipment JV

Once the route is repeatable, selected production equipment moves into a European joint venture with defined ownership, operating rules and product rights.

Partner-share buyout

A pre-agreed path allows Cybolution or a follow-on investor to acquire the partner's JV stake after technology and demand milestones are met.

Speed is designed into inventory.

First diffusion
longest step

→

Controlled semi-finished wafer bank

→

Order-specific finish
shorter route

Investor opportunity

Back a stage-gated route from process evidence to European production control.

Evidence first. Seed work is organised around physical wafers, profiles, finished devices and repeat lots.
Partner-enabled speed. Routine downstream operations remain with an experienced manufacturing partner during validation.
Compounding technical asset. Traceable diffusion, thickness and electrical-response data improve each subsequent lot.
Chip-first architecture. The same circular die can later be qualified into the customer’s chosen press-pack, stud or module assembly route through experienced partners.

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For discussion purposes only. This page does not constitute an offer to sell, or a solicitation of an offer to buy, any securities. Any investment opportunity will be made only through appropriate definitive documentation and subject to applicable law, eligibility, due diligence and risk disclosures. Product specifications, milestones and market-entry plans are management targets and remain subject to qualification.